February 2020 – MIRTEC, the ‘Global Leader in Inspection Technology’, will exhibit at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 24, 2020 at the Plano Event Center in Plano, TX, and the Houston Expo will be held Thursday, March 26, 2020 at The Stafford Centre in Stafford, TX.

“Customers are invited to visit with MIRTEC for a detailed ‘Virtual Demonstration’ of our Award-Winning OMNI-VISION 3D AOI Technology and our Revolutionary Intelli-Pro Automatic Programming Software!” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division.

MIRTEC’s Award-Winning MV-6 OMNI 3D AOI System combines their exclusive 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s proprietary OMNI-VISION^® 3D Digital Tri-Frequency Moiré Technology to provide precision inspection of SMT devices on finished PCB assemblies.

The equally impressive MV-3 OMNI Desktop 3D AOI system is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION^® 3D Inspection Systems providing 100% compatibility across MIRTEC’s entire 3D AOI product line.  Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine in the world! 

MIRTEC’s Automatic Programming Software uses Artificial intelligence based Deep Learning Methodology to minimize human error and standardize the programming process. This advanced software solution automatically analyzes the PCB architecture and assigns the appropriate part type and process parameters for each SMT device thereby maximizing programming efficiency.  Only basic operator training is required to achieve optimal inspection results.

MIRTEC’s Award-Winning MS-11E 3D SPI Machine is also configured with an exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.  The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

“MIRTEC continues to set new standards within the highly competitive Electronics Inspection Industry,” continued D’Amico.  “These revolutionary products provide unprecedented 3D inspection performance and the industry’s lowest cost of ownership making them an ideal solution for electronics manufacturing companies of all sizes. We look forward to demonstrating this advanced technology to attendees first-hand.”